JPS56164562U - - Google Patents
Info
- Publication number
- JPS56164562U JPS56164562U JP1980061788U JP6178880U JPS56164562U JP S56164562 U JPS56164562 U JP S56164562U JP 1980061788 U JP1980061788 U JP 1980061788U JP 6178880 U JP6178880 U JP 6178880U JP S56164562 U JPS56164562 U JP S56164562U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980061788U JPS6228780Y2 (en]) | 1980-05-08 | 1980-05-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980061788U JPS6228780Y2 (en]) | 1980-05-08 | 1980-05-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56164562U true JPS56164562U (en]) | 1981-12-07 |
| JPS6228780Y2 JPS6228780Y2 (en]) | 1987-07-23 |
Family
ID=29656159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980061788U Expired JPS6228780Y2 (en]) | 1980-05-08 | 1980-05-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228780Y2 (en]) |
-
1980
- 1980-05-08 JP JP1980061788U patent/JPS6228780Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6228780Y2 (en]) | 1987-07-23 |